Welcome to the 31st International Symposium on Discharge and Electrical Insulation in Vacuum (ISDEIV)

The International Symposium on Discharge and Electrical Insulation in Vacuum (ISDEIV) is a non-profit, international forum whose purpose is to encourage the advancement of the science and application of electrical insulation and discharges in vacuum, primarily by conducting symposia for the exchange of scientific information. The Symposium is held biennially for the exchange of results, presentation of progress, and discussion of ideas and challenges for the future of discharge and electrical insulation in vacuum. Both fundamental and applied aspects are covered. Symposium program consists of invited talks, invited oral contributions, and posters. Minicourses and informal discussions on relevant topics may also be offered in addition to the regular Symposium schedule.

The 31st ISDEIV will be held in the beautiful city, "The land of abundance", Chengdu, China, from Sept. 21 to 26, 2025. The conference will be hosted by Sichuan University, and technically sponsored by IEEE DEIS.

In the meantime, please contact us if you have questions on any aspect of the conference.



latest News

Call for paper is going to be released soon

Call for Sponsorship is released!


Important Dates

Abstract Submission:
Jun. 30, 2024~Jan. 10, 2025
Abstract Decision Notification:
Feb. 28, 2025
Paper Submission:
Mar. 1, 2025~May 31, 2025
Paper Final Decision Notification:
Jul. 10, 2025
Early Bird Registration:
Aug. 1, 2025
Conference Dates:
Sept. 21-26, 2025